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Configured for discrete actuator command execution in CompactLogix and MicroLogix 1500 system setups, the Allen-Bradley 1769-OB16 (1769-OB16 Digital Sourcing Output Module) provides direct physical/electrical execution. This solid-state module switch modifies the transmission of internal 24 VDC bus power onto 16 separate output points. These outputs drive secondary industrial field loads including magnetic solenoids, electrical contactors, and control panel indication arrays.
| Parameter | Specification |
|---|---|
| Model | 1769-OB16 |
| Brand | Allen-Bradley |
| Origin | United States |
| Weight | 0.28 kg |
| Dimensions | 118 x 35 x 87 mm |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 3.55 W maximum |
| Number of Outputs | 16 channels |
| Output Type | Sourcing (PNP) |
| Operating Voltage Range | 20.4 to 26.4 VDC |
| Output Current per Point | 0.5 A maximum |
| Maximum Module Current | 8.0 A at 30 deg C / 4.0 A at 60 deg C |
| Switching Response Time | 0.1 ms typical |
| Backplane Current Draw | 200 mA at 5.1 VDC |
| Power Supply Distance Rating | 8 modules maximum |
| Isolation Voltage | 75 VDC continuous basic isolation type |
The transistor array design adapts to high-speed data exchanges across remote architectures linked by Profinet or EtherNet/IP deterministic networks. Internal hardware structures allow rapid logic updates, yielding a 0.1 ms switching response time profile across all local channels. The system configuration software handles variable I/O density scaling routines to balance high-amperage simultaneous channel actuation states. This coordination occurs without introducing processing delay parameters into the underlying backplane communication velocity tracks.
Q: What are the continuous limits concerning the removal or insertion of this hardware module while the main chassis backplane is energized?
A: The module contains no live-insertion logic features. Removing or inserting this module while backplane power is active violates system parameters and can cause logic pin degradation or fatal CPU fault reports.
Q: How does internal electronic design protect individual output points against high-amperage circuit faults?
A: The module physical architecture integrates electronic short-circuit and overcurrent sensing circuits. When current levels exceed designated safety thresholds, the component selectively halts current transmission on the affected channel to protect the internal silicon traces.
Q: What configuration constraints must be implemented to manage the module thermal load inside tight enclosures?
A: The total continuous module current must be scaled based on ambient conditions, matching a limit of 8.0 A at 30 deg C or dropping down to a maximum of 4.0 A at 60 deg C. Additionally, the unit must sit within 8 slots of an active power supply card.
Ships within 48 hours · Estimated delivery Jun 26 - Jul 1
US$40
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